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PRODUCTS
Solutions for Spectroscopy, TCSPC & Imaging
- ~30 eV to ~20 keV x-ray sensitivity
- -90℃ deep cooling
- Rotatable ConFlat flange design
- 다양한 크기의 Imaging array(no AR coating)
|
Model |
Imaging array (pixels) |
Pixel Size |
Sensor Type |
Datasheet |
|
100B |
1340 x 100 |
20 x 20 μm |
Back-illuminated |
|
|
100BR |
1340 x 100 |
20 x 20 μm |
Back-illuminated deep-depletion |
|
|
400B |
1340 x 400 |
20 x 20 μm |
Back-illuminated |
|
|
400BR |
1340 x 400 |
20 x 20 μm |
Back-illuminated deep-depletion |
|
|
1024B |
1024 x 1024 |
13 x 13 μm |
Back-illuminated |
|
|
1024BR |
1024 x 1024 |
13 x 13 μm |
Back-illuminated deep-depletion |
|
|
2KB |
2048 x 512 |
13.5 x 13.5 μm |
Back-illuminated |
|
|
2048B |
2048 x 2048 |
13.5 x 13.5 μm |
Back-illuminated |
| Model | PIXIS-XO: 400B |
PIXIS-XO: 400BR |
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| CCD Image Sensor | Princeton Instruments exclusive; |
Princeton Instruments exclusive; |
|||
| Dark current @ -75° C (with ambient air @ +20° C) |
0.001 e-/p/sec (typical) |
0.03 e-/p/sec (typical) |
|||
| CCD format | 1340 x 400 imaging pixels; 20 x 20 mm pixels; 100% fill factor; 13.3 x 13.3 mm (optically centered) | ||||
| Deepest cooling temperature, TE air cooling* (with ambient air @ +20° C) |
-90° C typical; -75° C guaranteed | ||||
| Thermostating precision | ±0.05° C | ||||
| Cooling method | Thermoelectric air or liquid cooling (CoolCUBE II required) | ||||
| Full well | Single pixel: 100 ke- (typical), 60 ke- (minimum) High Sensitivity node: 250 ke- (typical), 220 ke- (minimum) High Capacity node: 1000 ke- (typical), 750 ke- (minimum) | ||||
| ADC speed/bits | 100 kHz/16-bit and 2 MHz/16-bit | ||||
| System read noise @100 kHz @2 MHz |
3.0 e- rms (typical), 5 e- rms (max) 11 e- rms (typical), 16 e- rms (max) | ||||
| Vertical shift speed | <15 msec/row (programmable) | ||||
| Non-linearity | <1% @ 100 kHz <2% @ 2 MHz |
||||
| Software selectable gains | 1, 2, 4 e- (high sensitivity); 4, 8, 16 e- (high capacity); available at all speeds | ||||
| Data interface | USB2.0 (5m interface cable provided); Optional Fiberoptic interface is available for remote operation | ||||
| I/O signals | Two MCX connectors for programmable frame readout, shutter, trigger in | ||||
| Operating environment | +5° C to +30° C non-condensing | ||||
| Bakeout temperature | 70° C (maximum) | ||||
| Vacuum Compatibility | 10 -8 Torr | ||||
| Certification | CE | ||||
| Dimensions / Weight | 16.59 cm (6.53") x 11.81 cm (4.65") x 11.38 cm (4.48") (L x W x H) / 2.27 kg (5 lbs) | ||||
- X-ray Spectroscopy
- EUV Lithography and X-ray Plasma Diagnostics
